AD8330 Analog Devices, AD8330 Datasheet - Page 4

no-image

AD8330

Manufacturer Part Number
AD8330
Description
Low Cost DC-150MHz Variable Gain Amplifier
Manufacturer
Analog Devices
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD8330ACPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD8330ACPZ
Quantity:
22
Part Number:
AD8330ACPZ-R7
Manufacturer:
AD
Quantity:
1 493
Part Number:
AD8330ACPZ-R7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8330ACPZ-RL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8330ARQ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8330ARQZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8330ARQZ-REEL
Manufacturer:
JJM
Quantity:
1 200
AD8330
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V
Power Dissipation
Input Voltage at Any Pin . . . . . . . . . . . . . . . . . . . V
Storage Temperature . . . . . . . . . . . . . . . . . . . –65∞C to +105∞C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8330 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
RQ Package
CP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.67 W
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.62 W
Model
AD8330ACP
AD8330ACP-REEL
AD8330ACP-REEL7
AD8330ARQ
AD8330ARQ-REEL
AD8330ARQ-REEL7
1
Temperature Range
–40ºC to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
–40ºC to +85ºC
S
+ 200 mV
ORDERING GUIDE
–4–
Operating Temperature Range . . . . . . . . . . . . –40∞C to +85∞C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300∞C
NOTES
1
2
Package Description
Chip Scale Package
Chip Scale Package
Thin Shrink SO
Thin Shrink SO
Chip Scale Package
Thin Shrink SO
Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Four-Layer JEDEC Board (252P).
Package Outline
LFCSP
LFCSP
LFCSP
QSOP
QSOP
QSOP
REV. A

Related parts for AD8330