MTB60N06HD Motorola, MTB60N06HD Datasheet

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MTB60N06HD

Manufacturer Part Number
MTB60N06HD
Description
TMOS POWER FET 60 AMPERES 60 VOLTS
Manufacturer
Motorola
Datasheet

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Designer's
HDTMOS
High Energy Power FET
D 2 PAK for Surface Mount
N–Channel Enhancement–Mode Silicon Gate
than any existing surface mount package which allows it to be used
in applications that require the use of surface mount components
with higher power and lower R DS(on) capabilities. This advanced
high–cell density HDTMOS power FET is designed to withstand
high energy in the avalanche and commutation modes. This new
energy efficient design also offers a drain–to–source diode with a
fast recovery time. Designed for low voltage, high speed switching
applications in power supplies, converters and PWM motor
controls, these devices are particularly well suited for bridge circuits
where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected
voltage transients.
(1) When mounted with the minimum recommended pad size.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET, Designer’s and HDTMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 2
MAXIMUM RATINGS
Motorola, Inc. 1995
Motorola TMOS Power MOSFET Transistor Device Data
Drain–Source Voltage
Drain–Gate Voltage (R GS = 1.0 M )
Gate–Source Voltage — Continuous
Gate–Source Voltage
Drain Current — Continuous
Drain Current
Drain Current
Total Power Dissipation
Total Power Dissipation @ T A = 25 C (1)
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting T J = 25 C
Thermal Resistance — Junction to Case
Thermal Resistance
Thermal Resistance
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
The D 2 PAK package has the capability of housing a larger die
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I DSS and V DS(on) Specified at Elevated Temperature
Short Heatsink Tab Manufactured — Not Sheared
Specially Designed Leadframe for Maximum Power Dissipation
Available in 24 mm 13–inch/800 Unit Tape & Reel, Add T4
Suffix to Part Number
Derate above 25 C
(V DD = 25 Vdc, V GS = 10 Vdc, Peak I L = 60 Apk, L = 0.3 mH, R G = 25
— Continuous @ 100 C
— Single Pulse (t p
— Junction to Ambient
— Junction to Ambient, when mounted with the minimum recommended pad size
— Non–Repetitive (t p
(T C = 25 C unless otherwise noted)
E-FET.
Data Sheet
10 s)
10 ms)
Rating
G
D
S
Symbol
T J , T stg
MTB60N06HD
V DGR
V GSM
V DSS
R JC
R JA
R JA
V GS
E AS
I DM
P D
T L
I D
I D
R DS(on) = 0.014 OHM
CASE 418B–02, Style 2
TMOS POWER FET
Motorola Preferred Device
60 AMPERES
60 VOLTS
– 55 to 150
Order this document
D 2 PAK
by MTB60N06HD/D
Value
42.3
62.5
180
125
540
260
1.0
2.5
1.0
60
60
60
50
20
30
Watts
Watts
W/ C
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
C/W
mJ
C
C
1

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MTB60N06HD Summary of contents

Page 1

... Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Motorola TMOS Power MOSFET Transistor Device Data Motorola, Inc. 1995 D G Rating 10 ms) Order this document by MTB60N06HD/D MTB60N06HD Motorola Preferred Device TMOS POWER FET 60 AMPERES 60 VOLTS R DS(on) = 0.014 OHM CASE 418B–02, Style PAK ...

Page 2

... MTB60N06HD ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc Vdc 125 C) Gate–Body Leakage Current ...

Page 3

... Figure 4. On–Resistance versus Drain Current 1000 100 10 1 100 125 150 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–to–Source Leakage MTB60N06HD 100 – 3.6 4.4 5.2 6.0 6.8 7 ...

Page 4

... MTB60N06HD Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...

Page 5

... In addition, power dissipation incurred from switching the diode will be less due to the shorter recovery time and lower switching losses 0.6 0.7 0.8 0 SOURCE–TO–DRAIN VOLTAGE (VOLTS) MTB60N06HD d(off) t d(on) 10 100 GATE RESISTANCE (Ohms) 1.0 5 ...

Page 6

... MTB60N06HD The Forward Biased Safe Operating Area curves define the maximum simultaneous drain–to–source voltage and drain current that a transistor can handle safely when it is for- ward biased. Curves are based upon maximum peak junc- tion temperature and a case temperature ( Peak ...

Page 7

... Mounted on the minimum recommended footprint 2.5 Collector/Drain Pad Size 2.0 1.5 1 TIME 0 AMBIENT TEMPERATURE ( C) Figure 16 PAK Power Derating Curve MTB60N06HD R JC ( CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME J(pk) – (pk (t) 1.0E+00 1.0E+01 450 mils x 350 mils 75 100 125 150 ...

Page 8

... MTB60N06HD INFORMATION FOR USING THE D 2 PAK SURFACE MOUNT PACKAGE RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface ...

Page 9

... Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D 2 PAK is not recommended for wave soldering. MTB60N06HD Ç Ç Ç Ç Ç Ç Ç Ç ...

Page 10

... MTB60N06HD For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next ...

Page 11

... Motorola TMOS Power MOSFET Transistor Device Data PACKAGE DIMENSIONS STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE K 4. DRAIN J H CASE 418B–02 ISSUE B MTB60N06HD NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.340 0.380 8.64 9 ...

Page 12

... EUROPE: Motorola Ltd.; European Literature Centre; 88 Tanners Drive, Blakelands, Milton Keynes, MK14 5BP, England. JAPAN: Nippon Motorola Ltd.; 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 12 *MTB60N06HD/D* Motorola TMOS Power MOSFET Transistor Device Data MTB60N06HD/D ...

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