SPI-336-99-T1 Sanyo Semicon Device, SPI-336-99-T1 Datasheet - Page 5

• Manufacturer Part Number: SPI-336-99-T1
• Description: Ultraminiature photoreflector supporting reflow soldering Single transistor type
• Manufacturer: Sanyo Semicon Device

Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
(2) Manusl soldering
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
q The product after the open dry packing should be stored in the dry packing again.
w The product to be out the term without dry packing must be practiced baking.
PRECAUTIONS
stress for the regin part cause troubles such as gold wire breaking and so on.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
Reflow type
Temperature
Time
Clearance
Temperature
Humidity
Term
Baking conditions
Max 240 C
Max 165 C
200 C
: On the topsurface of product
: Hot air
: Max. 290 C (Soldering iron tip temperature)
: Max. 3 sec
: Min. 0.5mm from package
: 5 to 30 C
: Max 70%RH
: Max 7days
: +60 5 C, 10 to 20Hr
Max 120sec
SPI-336-99-T1
Max 10sec
Max 60sec
0.5mm
0.5mm
No.6030 5/6