SBT-BGA-7003 Ironwood Electronics, SBT-BGA-7003 Datasheet - Page 2

• Manufacturer Part Number: SBT-BGA-7003
• Description: Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Siz
• Manufacturer: Ironwood Electronics

Description:SBT-BGA-7003 Recommended Layout 8x8mm, 0.5mm pitch, 14x14 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: [phone]
12.7250
3.1125
SBT-BGA-7003 Drawing
1.2825±0.0250
WEIGHT:
MATERIAL:
FINISH:
15.2250
6.5000
17.7250
3.3625*
12.7250
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-7003
3.8225±0.0250
0.3000 (x196 PAD)
0.5000 Typ.
1.7100±0.1000 (x4)
0.8500
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
SHEET 2 OF 4
SCALE: 4:1
DATE: 5/21/2009
REV. A