SBT-BGA-7003 Ironwood Electronics, SBT-BGA-7003 Datasheet - Page 3

• Manufacturer Part Number: SBT-BGA-7003
• Description: Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Siz
• Manufacturer: Ironwood Electronics

Description: BGA with 196 pin with 0.5mm Pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
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Ironwood Electronics, Inc.
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SBT-BGA-7003 Drawing
D
WEIGHT:
MATERIAL:
FINISH:
Z
A
SCALE 16 : 1
DETAIL A
E
0.1 Z
0.15 X Y
0.08
A1
A
0.08 Z
STATUS:
DRAWN BY: Vinayak R
File: SBT-BGA-7003
b
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball
diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of
the solder balls.
5. Parallelism measurement shall exclude any effect of mark on
top surface of package.
DIM
A1
D
A
E
b
e
Minimum
0.25
0.2
14x14 Array
SHEET 3 OF 4
SCALE: 8:1
DATE: 5/21/2009
8.0 BSC
8.0 BSC
0.5 BSC
Maximum
2.5
0.4
0.4
REV. A
e