FP1189 WJ Communications, FP1189 Datasheet - Page 10

• Manufacturer Part Number: FP1189
• Description: HFET
• Manufacturer: WJ Communications

DataSheet4U.com
www.DataSheet4U.com
DataSheet
WJ Communications, Inc
4
U
.com
FP1189
½-Watt HFET
Phone 1-800-WJ1-4401 FAX: [phone]
Outline Drawing
Land Pattern
DataSheet4U.com
e-mail: [e-mail]
The component will be marked with an “FP1189”
designator with a four- or five-digit alphanumeric lot
code on the top surface of the package. Tape and reel
specifications for this part is located on the website in
the “Application Notes” section.
ESD Classification:
Value:
Test:
Standard:
ESD Classification:
Value:
Test:
Standard:
MSL Rating:
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Web site: www.wj.com
DataSheet4U.com
The Communications Edge
Specifications and information are subject to change without notice.
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
board in the region where the board contacts the
heatsink.
and construction.
in degrees.
Mounting Config. Notes
ESD / MSL Information
Product Marking
Class 1B
Passes at 800 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes at 2000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Level 3
JEDEC Standard J-STD-020A
Product Information
TM
June 2003