MC14027BCPG ON Semiconductor, MC14027BCPG Datasheet - Page 8

• Manufacturer Part Number: MC14027BCPG
• Description: IC FLIP-FLOP JK DUAL CMOS 16DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: JK Typer

Specifications of MC14027BCPG

• Function: Set(Preset) and Reset
• Output Type: Differential
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Frequency - Clock: 13MHz
• Delay Time - Propagation: 50ns
• Trigger Type: Positive Edge
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Circuit Type: Low-Power Schottky
• Current, Supply: 120 μA
• Function Type: 2-Channels
• Logic Function: Flip-Flop
• Logic Type: CMOS
• Number Of Circuits: Dual
• Package Type: PDIP-16
• Special Features: J-K
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Logic Family: 4000
• Technology: CMOS
• Number Of Bits: 2
• Number Of Elements: 2
• Clock-edge Trigger Type: Positive-Edge
• Polarity: Invert/Non-Invert
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Propagation Delay Time: 450ns
• Low Level Output Current: 4.2mA
• High Level Output Current: -4.2mA
• Frequency (max): 6.5MHz
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: MC14027BCPGOS

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e
16
1
0.13 (0.005)
Z
b
D
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
PLASTIC EIAJ SOIC PACKAGE
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USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
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PACKAGE DIMENSIONS
M
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http://onsemi.com
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CASE 966−01
MC14027B
SOEIAJ−16
F SUFFIX
ISSUE O
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DETAIL P
8
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1
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NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
E
E
1
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.18
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
MC14027B/D
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_