MC14175BCPG ON Semiconductor, MC14175BCPG Datasheet - Page 5

• Manufacturer Part Number: MC14175BCPG
• Description: IC FLIP FLOP QUAD TYPE D 16-DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: D-Type Busr

Specifications of MC14175BCPG

• Function: Reset
• Output Type: Differential
• Number Of Elements: 1
• Number Of Bits Per Element: 4
• Frequency - Clock: 14MHz
• Delay Time - Propagation: 70ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Logic Family: 4000
• Technology: CMOS
• Number Of Bits: 4
• Number Of Elements: 1
• Clock-edge Trigger Type: Positive-Edge
• Polarity: Invert/Non-Invert
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Package Type: PDIP
• Propagation Delay Time: 500ns
• Low Level Output Current: 4.2mA
• High Level Output Current: -4.2mA
• Frequency (max): 6.5MHz
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 16
• Circuit Type: Low-Power Schottky
• Current, Supply: 600 μA
• Function Type: 4-Channels, D-Type
• Logic Function: Flip-Flop
• Logic Type: CMOS
• Number Of Circuits: Quad
• Special Features: Buffered Output
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC14175BCPG; MC14175BCPGOS

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14175B
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
5
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
M
A
B
C
D
F
G
K
P
R
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
10
INCHES
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_