LTC3553 Linear Technology Corporation, LTC3553 Datasheet - Page 35

• Manufacturer Part Number: LTC3553
• Description: Micropower USB Power Manager
• Manufacturer: Linear Technology Corporation

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PACKAGE DESCRIPTION
3.50 ± 0.05
2.10 ± 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.60 ± 0.05
3.00 ± 0.10
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
1.65 ±0.05
3.00 ± 0.10
1.65 ±0.05
20-Lead Plastic UTQFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1835 Rev Ø)
0.40 BSC
0.20 ±0.05
0.00 – 0.05
0.150 REF
0.70 ±0.05
PD Package
PACKAGE
OUTLINE
0.55 ± 0.05
1.60 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.10
TYP
1.65 ±0.10
1.65 ±0.10
19 20
0.40 BSC
0.20 ± 0.05
1
2
(PD20) UTQFN 0409 REV Ø
0.40 ± 0.10
PIN 1 NOTCH
0.35 45°
CHAMFER
LTC3553
35
3553f