LTC3858 Linear Technology, LTC3858 Datasheet - Page 36

• Manufacturer Part Number: LTC3858
• Description: Synchronous Step-Down Controller
• Manufacturer: Linear Technology

package DescripTion
LTC3858

5.50 0.05
4.10 0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.45 0.05
5.00 0.10
3.45 0.05
(4 SIDES)
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1693 Rev D)
32-Lead Plastic QFN (5mm × 5mm)
0.70 0.05
PACKAGE OUTLINE
UH Package
0.75 0.05
(4-SIDES)
0.00 – 0.05
3.50 REF
0.200 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 0.10
TYP
3.45 0.10
31
0.50 BSC
www.DataSheet4U.com
0.25 0.05
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 45 CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 0.10
3858fa