LTC3868 Linear Technology, LTC3868 Datasheet - Page 27

• Manufacturer Part Number: LTC3868
• Description: Low IQ Dual 2-Phase Synchronous Step-Down Controller
• Manufacturer: Linear Technology

applicaTions inForMaTion
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 10. Figure 11 illustrates the current
waveforms present in the various branches of the 2-phase
synchronous regulators operating in the continuous mode.
Check the following in your layout:
1. A re the top N-channel MOSFETs MTOP1 and MTOP2
2. A re the signal and power grounds kept separate? The
3. D o the LTC3868 V
4. A re the SENSE
5. Is the INTV
located within 1cm of each other with a common drain
connection at C
decoupling for the two channels as it can cause a large
resonant loop.
combined IC signal ground pin and the ground return
of C
minals. The path formed by the top N-channel MOSFET,
Schottky diode and the C
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
the (+) terminals of C
connected between the (+) terminal of C
ground. The feedback resistor connections should not
be along the high current input feeds from the input
capacitor(s).
minimum PC trace spacing? The filter capacitor between
SENSE
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
to the IC, between the INTV
pins? This capacitor carries the MOSFET drivers’ cur-
rent peaks. An additional 1µF ceramic capacitor placed
immediately next to the INTV
improve noise performance substantially.
INTVCC
+
and SENSE
must return to the combined C
CC
decoupling capacitor connected close
–
and SENSE
IN
FB
? Do not attempt to split the input
pins’ resistive dividers connect to
–
OUT
should be as close as possible
? The resistive divider must be
IN
capacitor should have short
+
leads routed together with
CC
CC
and PGND pins can help
and the power ground
OUT
OUT
and signal
(–) ter-
6. Keep the switching nodes (SW1, SW2), top gate nodes
7. Use a modified star ground technique: a low impedance,
PC Board Layout Debugging
Start with one controller on at a time. It is helpful to use
a DC-50MHz current probe to monitor the current in the
inductor while testing the circuit. Monitor the output
switching node (SW pin) to synchronize the oscilloscope
to the internal oscillator and probe the actual output
voltage as well. Check for proper performance over the
operating voltage and current range expected in the ap-
plication. The frequency of operation should be maintained
over the input voltage range down to dropout and until
the output load drops below the low current operation
threshold—typically 10% of the maximum designed
current level in Burst Mode operation.
The duty cycle percentage should be maintained from cycle
to cycle in a well-designed, low noise PCB implementation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pickup at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regula-
tor bandwidth optimization is not required. Only after
each controller is checked for its individual performance
should both controllers be turned on at the same time.
A particularly difficult region of operation is when one
controller channel is nearing its current comparator trip
point when the other channel is turning on its top MOSFET.
This occurs around 50% duty cycle on either channel due
to the phasing of the internal clocks and may cause minor
duty cycle jitter.
(TG1, TG2), and boost nodes (BOOST1, BOOST2) away
from sensitive small-signal nodes, especially from
the opposites channel’s voltage and current sensing
feedback pins. All of these nodes have very large and
fast moving signals and therefore should be kept on
the output side of the LTC3868 and occupy minimum
PC trace area.
large copper area central grounding point on the same
side of the PC board as the input and output capacitors
with tie-ins for the bottom of the INTV
capacitor, the bottom of the voltage feedback resistive
divider and the SGND pin of the IC.
www.DataSheet4U.com
LTC3868
CC
decoupling

3868fb