SC18IS603 NXP Semiconductors, SC18IS603 Datasheet - Page 19

• Manufacturer Part Number: SC18IS603
• Description: I2C-bus to SPI bridge
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 23. Package outline SOT403-1 (TSSOP16)
SC18IS602_602B_603_4
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
Rev. 04 — 11 March 2008
(1)
w
E
4.5
4.3
M
(2)
JEITA
scale
2.5
0.65
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
SC18IS602/602B/603
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
I
2
C-bus to SPI bridge
X
v
0.1
A
© NXP B.V. 2008. All rights reserved.
y
M
www.DataSheet4U.com
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o
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