cy2dp3120 Cypress Semiconductor Corporation., cy2dp3120 Datasheet - Page 3

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cy2dp3120

Manufacturer Part Number
cy2dp3120
Description
1 20 Differential Clock/data Fanout Buffer
Manufacturer
Cypress Semiconductor Corporation.
Datasheet
Document #: 38-07514 Rev.*C
Absolute Maximum Ratings
Operating Conditions
PECL/HSTL DC Electrical Specifications
V
V
T
T
ESD
M
Gate Count Total Number of Used Gates
Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
I
LU
T
Ø
Ø
I
C
L
V
V
V
I
V
V
V
V
V
V
V
V
Notes:
10. Equivalent to a termination of 50:
11. V
BB
EE
IN
Parameter
Parameter
4. Theta JA EIA JEDEC 51 test board conditions (typical value); Theta JC 883E Method 1012.1
5. Power Calculation: V
6. where V
7. Inputs have internal pull-up/pull-down or biasing resistors which affect the input current.
8. Refer to Figure 1
9. V
Parameter
A
S
J
IN
CC
EE
IN
TT
OUT
CC
CMR
X
OH
OL
IH
IL
BB
IN
Jc
Ja
SL
I
swing lies within the V
[3]
X
IL
h
(AC) is the crosspoint of the differential HSTL input signal. Normal AC operation is obtained when the crosspoint is within the V
will operate down to V
CC
is 3.3V±5% or 2.5V±5%
Positive Supply Voltage
Negative Supply Voltage
Temperature, Storage
Temperature, Junction
ESD Protection
Moisture Sensitivity Level
Output Reference Current
Latch Up Immunity
Temperature, Operating Ambient
Dissipation, Junction to Case
Dissipation, Junction to Ambient
Maximum Quiescent Supply Current
Input pin capacitance
Pin Inductance
Input Voltage
Output Termination Voltage
Output Voltage
Input Current (ECL,PECL and HSTL)
Operating Voltage
PECL Input Differential Crosspoint
Voltage
HSTL Input Differential Crosspoint Volt-
age
Output High Voltage
Output Low Voltage
V
V
Input Voltage, High
Input Voltage, Low
Output Reference Voltage
CC
CC
[9]
= 3.3V ± 5%
= 2.5V ± 5%
CC
DIF
[8]
* I
(AC) specification. Violation of V
EE
EE
; V
+0.5 (I
IH
Description
Description
Description
will operate up to V

to VTT. I
OH
+ I
OL
OHMIN
) (V
OH
=(V
– V
CC
OHMIN
OL
) (number of differential outputs used); I
X
(AC) or V
-V
[7]
TT
)/50; I
Non-Functional
Non-Functional
Functional
Functional
V
Non-Functional
Non-Functional
Human Body Model
Assembled Die
Relative to V
Functional, typical
Functional
Relative to V
Relative to V
Relative to V
V
2.5V ± 5%, V
3.3V ± 5%, V
Differential operation
Standard Load Differential
Operation
I
I
Single-ended operation
Single-ended operation
Relative to V
OH
OL
DIF
EE
IN
OHMAX
(AC) impacts the device propagation delay, device and part-to-part skew. Refer to Fig. 2.
= V
= –5 mA
= –30 mA
pin
IL
=(V
, or V
Condition
Condition
Condition
OHMAX
[10]
BB
CC
CC
CC
CC
EE
EE
[10]
IN
[6]
[6]
[6]
-V
[6]
= V
= 0.0V
= 0.0V
TT
)/50; I
IH
OLMIN
EE
does not include current going off chip.
=(V
V
OLMIN
CC
V
V
V
V
V
CC
CC
CC
CC
CC
– 1.945
2.375
3.135
Min.
0.68
-V
1.2
– 1.995
– 1.165
– 1.620
Min.
Min.
–1.995
–0.3
–0.3
–0.3
-4.6
– 1.25
–65
–40
TT
)/50; I
FastEdge™ Series
[11]
V
OLMAX
2000
22
60
CC
100
50
3
[4]
[4]
V
– 2
=(V
CC
V
V
X
V
V
V
V
V
CC
CC
(AC) range and the input
CY2DP3120
OLMAX
CC
CC
CC
CC
CC
– 0.880
250
2.625
3.465
Max.
+150
Max.
|200|
Max.
l150l
V
150
+85
4.6
0.3
0.9
– 1.625
– 1.220
3
1
CC
– 0.7
– 1.5
– 1.3
+ 0.3
+ 0.3
[5]
-V
TT
)/50;
[11]
Page 3 of 9
gates
°C/W
°C/W
Unit
N.A.
Unit
Unit
mA
mA
nH
uA
pF
uA
°C
°C
°C
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V

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