upd178016 Renesas Electronics Corporation., upd178016 Datasheet - Page 89

• Manufacturer Part Number: upd178016
• Description: 8-bit Single-chip Microcontroller
• Manufacturer: Renesas Electronics Corporation.

14. RECOMMENDED SOLDERING CONDITIONS
Manual (C10535E).
different conditions.
PD178016GC-051-3B9: 80-pin plastic QFP (14
Infrared ray reflow
VPS
Wave soldering
Partial heating method
The conditions listed below shall be met when soldering the PD178016GC-051.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Soldering process
Table 14-1. Soldering Conditions for Surface-Mount Devices
Peak package’s surface temperature: 235 C
Reflow time: 30 seconds or less (at 210 C or more)
Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 C
Reflow time: 40 seconds or less (at 200 C or more)
Maximum allowable number of reflow processes: 3
Solder temperature: 260 C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature: 120 C max. (measured on the
Terminal temperature: 300 C or less
Heat time: 3 seconds or less (for one side of a device)
Soldering conditions
package surface)
14 mm, 0.65-mm pitch)
IR35-00-3
VP15-00-3
WS60-00-1
PD178016GC-051
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