da6270 Micro Analog Systems Oy, da6270 Datasheet - Page 2

• Manufacturer Part Number: da6270
• Description: Ic For 6.50 ? 40.00 Mhz Vctcxo
• Manufacturer: Micro Analog Systems Oy

BLOCK DIAGRAM
PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to VSS, the die has to be connected to VSS or
left floating. Please make sure that VSS is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note: Test Multiplexer Output is for testing only and must not be connected in an end user application.
Pin Description MAS6270A
Test Multiplexer Output
Temperature Input / Output
Serial Bus Data Input
Serial Bus Clock Input
Programming Input
Power Supply Voltage
Voltage Control Input
XO Output (crystal connection)
XO Input (crystal connection)
Power Supply Ground
Buffered Output
VDD
CLK
DA
PV
VC
VSS
CDACC(3:0)
TFRPROM
CDACF(5:0)
VC_SENS
SCALE(4:0)
V divider
SENS(2:0)
AMPL(0:0)
TEST(2:0)
CUB(3:0)
DIV(0:0)
INF(4:0)
LIN(7:0)
To all blocks
f(T) = Ax
POLYNOMIAL
Figure 1. Block diagram of MAS6270.
3
+Bx+C
Symbol
MOUT
XOUT
XIN
VDD
VSS
OUT
CLK
XIN
TIN
DA
VC
PV
FILTER
OUT
XO
core
CDACC
x-coordinate
1083
1256
1718
1687
1210
140
624
771
848
495
134
CDACF
Thermal
sensor
XOUT
VREF
f |
Buffer+
divider
f
/
2
y-coordinate
TEST
MUX
16 October 2008
1219
1219
1219
1219
1219
142
142
142
142
140
142
DA6270.002
OUT
TIN
MOUT
2 (10)