ma4agsbp907 M/A-COM Technology Solutions, Inc., ma4agsbp907 Datasheet - Page 5

no-image

ma4agsbp907

Manufacturer Part Number
ma4agsbp907
Description
Algaas Solder Bump Flip-chip Diode
Manufacturer
M/A-COM Technology Solutions, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MA4AGSBP907
Manufacturer:
M/A-COM
Quantity:
5 000
Part Number:
MA4AGSBP907
Manufacturer:
MA/COM
Quantity:
20 000
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
AlGaAs Solder Bump
Flip-Chip PIN Diode
MA4AGSBP907
The following guidelines should be observed to avoid damaging the AlGaAs flip-chips.
Cleanliness
These devices should be handled in a clean environment.
Static Sensitivity
Aluminum gallium arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper
ESD techniques should be used when handling these devices. These devices are rated Class 0, (0-199V) per
HBM MIL-STD-883, method 3015.7 [C = 100pF±10%, R = 1.5kW±1%]. Even though tested die pass 50V ESD,
they must be handled in a static-free environment.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum
pencil.
Assembly Requirements using Tin / Lead Solder
The flip chip diode employs a 6μm thick, Sn/Pb, 63/37 solderable interface as part of the 50µm high solder
bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They
should be mounted onto silkscreened circuits using 63/37 Sn/Pb solder paste. A typical profile for a Sn/Pb
63/37 soldering process is provided in on the M/A-COM website at this address:
Application%20Notes/pdf/M538.pdf.
Device Installation Guidelines
RoHS Compliant
MA4AGSBP907
Part Number
Ordering Information
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Die in Carrier
Visit www.macomtech.com for additional data sheets and product information.
Packaging
http://www.macom.com/
Rev. V4

Related parts for ma4agsbp907