74ALVCH16374DL,118 NXP Semiconductors, 74ALVCH16374DL,118 Datasheet
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74ALVCH16374DL,118
Specifications of 74ALVCH16374DL,118
74ALVCH16374DL-T
935260444118
Related parts for 74ALVCH16374DL,118
74ALVCH16374DL,118 Summary of contents
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V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Rev. 03 — 27 April 2010 1. General description The 74ALVCH16374 is 16-bit edge-triggered flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications. Incorporates bus ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Temperature range Package −40 °C to +85 °C 74ALVCH16374DL −40 °C to +85 °C 74LVCH16374DGG 4. Functional diagram Fig 1. Logic symbol 74ALVCH16374_3 Product data sheet 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Name Description SSOP48 plastic shrink small outline package ...
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... NXP Semiconductors Fig 2. IEC logic symbol Fig 3. Bus hold circuit 1D0 1CP 1OE Fig 4. Logic diagram 74ALVCH16374_3 Product data sheet 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 1 1OE 1EN 48 1CP C1 24 2OE 2EN 25 2CP C2 47 1D0 1D1 44 1D2 43 1D3 41 1D4 40 1D5 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 5. Pin configuration 74ALVCH16374_3 Product data sheet 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state 74ALVCH16374 1 1OE 1Q0 2 1Q1 3 GND 4 1Q2 5 6 1Q3 1Q4 8 1Q5 9 GND 10 11 1Q6 12 1Q7 2Q0 13 2Q1 14 GND 15 16 2Q2 17 2Q3 V 18 ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 1OE, 2OE 1, 24 1Q0 to 1Q7 11, 12 2Q0 to 2Q7 13, 14, 16, 17, 19, 20, 22, 23 GND 4, 10, 15, 21, 28, 34, 39 18, 31 1D0 to 1D7 47, 46, 44, 43, 41, 40, 38, 37 2D0 to 2D7 36, 35, 33, 32, 30, 29, 27, 26 1CP, 2CP 48 ...
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... NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter = −40 °C to +85 °C T amb V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I OFF-state output ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter ΔI additional supply CC current I bus hold LOW current BHL I bus hold HIGH current BHH I bus hold LOW BHLO overdrive current I bus hold HIGH BHHO overdrive current ...
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... NXP Semiconductors Table 7. Dynamic characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V); test circuit Symbol Parameter t disable time dis t pulse width W t set-up time su t hold time h C power dissipation PD capacitance [1] All typical values are measured at T [2] Typical values are measured at V ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in V and V are typical output levels that occur with the output load Fig 6. Propagation delay, clock input (nCP) to data output (nQn), and pulse width nOE input nQn output LOW-to-OFF OFF-to-LOW nQn output HIGH-to-OFF OFF-to-HIGH ...
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... NXP Semiconductors Table 8. Measurement points Supply voltage Input 2 2.7 V and V CC < 2.3 V 2.7 V 2 3.6 V 2.7 V 12. Test information Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z ...
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... NXP Semiconductors 13. Package outline SSOP48: plastic shrink small outline package; 48 leads; body width 7 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.4 2.35 mm 2.8 0.25 0.2 2.20 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm 1.2 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state Data sheet status Product data sheet – The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. – Legal texts have been adapted to the new company name where appropriate. – Table 7 “Dynamic characteristics” ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74ALVCH16374_3 Product data sheet 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 03 — 27 April 2010 74ALVCH16374 © ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 5 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Test information ...