si2493 Silicon Laboratories, si2493 Datasheet - Page 53
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si2493
Manufacturer Part Number
si2493
Description
V.92 Isomodem With Global Daa
Manufacturer
Silicon Laboratories
Datasheet
1.SI2493.pdf
(60 pages)
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12. Package Outline: 24-Pin TSSOP
Figure 14 illustrates the package details for the Si2493 24-pin packaging option. Table 15 lists the values for the
dimensions shown in the illustration.
Notes:
Figure 14. 24-Pin Thin Shrink Small Outline Package (TSSOP)
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153,
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
Dimension
Variation AD.
specification for Small Body Components.
aaa
bbb
ccc
A1
A2
E1
L2
D
A
E
b
c
e
L
θ
Table 15. Package Diagram Dimensions
0.05
0.80
0.19
0.09
7.70
4.30
0.45
Min
—
0°
Rev. 1.3
6.40 BSC
0.65 BSC
0.25 BSC
Nom
1.00
7.80
4.40
0.60
0.10
0.10
0.20
—
—
—
—
—
Max
1.20
0.15
1.05
0.30
0.20
7.90
4.50
0.75
8°
Si2493
53