si2493 Silicon Laboratories, si2493 Datasheet - Page 53

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si2493

Manufacturer Part Number
si2493
Description
V.92 Isomodem With Global Daa
Manufacturer
Silicon Laboratories
Datasheet

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12. Package Outline: 24-Pin TSSOP
Figure 14 illustrates the package details for the Si2493 24-pin packaging option. Table 15 lists the values for the
dimensions shown in the illustration.
Notes:
Figure 14. 24-Pin Thin Shrink Small Outline Package (TSSOP)
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153,
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
Dimension
Variation AD.
specification for Small Body Components.
aaa
bbb
ccc
A1
A2
E1
L2
D
A
E
b
c
e
L
θ
Table 15. Package Diagram Dimensions
0.05
0.80
0.19
0.09
7.70
4.30
0.45
Min
Rev. 1.3
6.40 BSC
0.65 BSC
0.25 BSC
Nom
1.00
7.80
4.40
0.60
0.10
0.10
0.20
Max
1.20
0.15
1.05
0.30
0.20
7.90
4.50
0.75
Si2493
53

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