isl3874 Intersil Corporation, isl3874 Datasheet - Page 33

• Manufacturer Part Number: isl3874
• Description: Wireless Lan Integrated Medium Access Controller With Baseband Processor With Mini-pci
• Manufacturer: Intersil Corporation

Plastic Ball Grid Array Packages (BGA)
o
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
2401 Palm Bay Rd., Mail Stop 53-204
Palm Bay, FL 32905
TEL: [phone]
FAX: [phone]
CORNER I.D.
CORNER
C
0.006
0.003
A
0.15
0.08
A1
S
A
A1
b
M
M
A1
C
C
A2
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
16
A B
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
15
14
13
12 11 10 9
BOTTOM VIEW
S
SIDE VIEW
TOP VIEW
33
A
D1
D
8
7 6 5
4
SEATING PLANE
ALL ROWS AND COLUMNS
3
2
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: [phone]
FAX: [phone]
1
A
E
e
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B
E1
bbb
A1
CORNER I.D.
A1
CORNER
aaa
C
ISL3874
C
V192.14x14
192 BALL PLASTIC BALL GRID ARRAY PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: MILLIMETER. Converted inch
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
6. Dimension “A” includes standoff height “A1”, package body
7. Dimension “b” is measured at the maximum ball diameter,
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
MD/ME
D1/E1
D/E
bbb
aaa
A1
A2
dimensions are not necessarily exact.
and “E” dimensions, respectively.
ical crowns of the contact balls.
thickness and lid or cap height “A2”.
parallel to the primary datum C.
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
N
A
b
e
0.012
0.033
0.016
0.547
0.468
MIN
-
0.032 BSC
INCHES
16 x 16
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: [phone]
FAX: [phone]
0.004
0.005
192
MAX
0.059
0.016
0.039
0.020
0.555
0.476
13.90
11.90
0.31
0.83
0.41
MILLIMETERS
MIN
-
0.80 BSC
16 x 16
0.10
0.12
192
14.10
12.10
MAX
1.40
0.41
0.99
0.51
Rev. 1 1/01
NOTES
7
3
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