ir3502b International Rectifier Corp., ir3502b Datasheet - Page 36

• Manufacturer Part Number: ir3502b
• Description: Xphase3 Control Ic
• Manufacturer: International Rectifier Corp.

Solder Resist
 The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
 The minimum solder resist width is 0.13mm.
 At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
 The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
 Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
 The vias in the land pad should be tented or plugged from bottom boardside with solder resist.
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
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IR3502B
V3.2