mcf5208 Freescale Semiconductor, Inc, mcf5208 Datasheet - Page 45

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mcf5208

Manufacturer Part Number
mcf5208
Description
Mcf5208 Coldfire Microprocessor Data Sheet
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Freescale Semiconductor
Revision
Number
0.4
0.5
0.6
1
10/10/2005
3/29/2006
7/21/2006
3/28/2007
Date
MCF5208 ColdFire
Table 26. Revision History (continued)
• Added “top view” and “bottom view” labels where appropriate to
• Updated mechanical drawings to latest available, and added note to
• Corrected cross-reference to
• Corrected L3 label in
• Corrected L6 label in
• Removed second sentence from
• Removed third and fourth paragraphs from
• Removed preliminary designation from
• Updated
• Updated
• Added
• Updated
• Made some corrections to the drawings in
• Edited for grammar, punctuation, spelling, style, and format. - JD
Figure 1
Figure 4
Figure 6
from TEST to VSS
mechanical drawings and pinouts.
Section 4, “Mechanicals and Pinouts.”
MAPBGA.”
SD_DQS1 to SD_DQS3.
Timing (FEC_TXD[3:0], FEC_TXEN, FEC_TXER, FEC_TXCLK),”
regarding no minimum frequency requirement for TXCLK.
Signal Timing (FEC_TXD[3:0], FEC_TXEN, FEC_TXER, FEC_TXCLK),”
as this feature is not supported on this device.
Characteristics.”
®
Microprocessor Data Sheet, Rev. 1
Section 5.5, “Current Consumption.”
and
and
and
Section 5.2, “Thermal Characteristics.”
Section 5.4, “DC Electrical Specifications.”
Section 5.6, “Oscillator and PLL Electrical Characteristics.”
Table
Table
Table
3: Changed pin 39 from EVDD to SD_VDD and pin 117
3: Changed pin 33 from EVDD to SD_VDD
3: Changed ball D10 from TEST to VSS
Figure 9
Figure 9
Substantive Changes
Figure 9
from SD_DQS0 to SD_DQS2 and H3 from
from SD_DR_DQS to SD_SDR_DQS.
Section 5.12.2, “MII Transmit Signal
in
Section 5, “Electrical
Section 4.7, “Pinout—196
Section 5.8, “SDRAM Bus.”
Section 5.12.2, “MII Transmit
Revision History
45

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