c150kgct HB Electronic Components, c150kgct Datasheet - Page 9

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c150kgct

Manufacturer Part Number
c150kgct
Description
Hebeiltd Led Specification
Manufacturer
HB Electronic Components
Datasheet
4. Lead-Free Soldering
DRAWING NO. : DS-71-03-0005
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1
For Reflow Soldering :
1 、 Pre-Heat Temp:150-180 ℃ ,120sec.Max.
2 、 Soldering Temp:Temperature Of Soldering Pot Over 230 ℃ ,40sec.Max.
3 、 Peak Temperature:260 ℃, 5sec.
4 、 Reflow Repetition:2 Times Max.
5 、 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 B /0.5 Cu
For Soldering Iron (Not Recommended) :
1 、 Iron Tip Temp:350 ℃ Max.
2 、 Soldering Iron:30w Max.
3 、 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1 、 Pre-Heat Temp:150 ℃ Max. 120 Sec. Max.
2 、 Bath Temp:265 ℃ Max.
3、Dip Time:5 Sec. Max.
SURFACE MOUNT DEVICE LED
Part No. : L-C150KGCT
st
and 2
nd
DATE : 2004-06-07
soldering processes.
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