MC74AC273DWR2G ON Semiconductor, MC74AC273DWR2G Datasheet - Page 6

• Manufacturer Part Number: MC74AC273DWR2G
• Description: IC FLIP FLOP D OCTAL CMOS 20SOIC
• Manufacturer: ON Semiconductor
• Series: 74ACr
• Type: D-Type Busr

Specifications of MC74AC273DWR2G

• Function: Master Reset
• Output Type: Non-Inverted
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Frequency - Clock: 175MHz
• Delay Time - Propagation: 5.5ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74AC273DWR2GOS

SEATING
PLANE
−T−
20
20
1
1
MC74ACT273N
MC74AC273N
AWLYYWWG
AWLYYWWG
20
1
PDIP−20
G
E
−A−
F
D
20
20
1
1
20 PL
10
11
0.25 (0.010)
SOIC−20WB
N
AWLYYWWG
AWLYYWWG
(Note: Microdot may be in either location)
MC74AC273, MC74ACT273
B
ACT273
AC273
A
WL, L
YY, Y
WW, W
G or G
PACKAGE DIMENSIONS
K
MARKING DIAGRAMS
M
http://onsemi.com
C
T
CASE 738−03
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
N SUFFIX
PDIP−20
ISSUE E
M
6
J
L
20 PL
20
20
1
1
0.25 (0.010)
TSSOP−20
ALYWG
ALYWG
ACT
273
273
AC
G
G
M
M
T
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
G
M
A
B
C
D
E
F
J
K
L
N
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
20
20
MIN
1
1
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
SOEIAJ−20
MAX
AWLYWWG
AWLYWWG
15
74ACT273
74AC273
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_