s29al016j Meet Spansion Inc., s29al016j Datasheet - Page 13

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s29al016j

Manufacturer Part Number
s29al016j
Description
16 Megabit 2 M X 8-bit/1 M X 16-bit Cmos 3.0 Volt-only Boot Sector Flash Memory
Manufacturer
Meet Spansion Inc.
Datasheet

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6.
6.1
May 23, 2008 S29AL016J_00_05
Ordering Information
S29AL016J Standard Products
Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes
1. Type 0 is standard. Specify other options as required.
2. Type 1 is standard. Specify other options as required.
3. TSOP package markings omit packing type designator from ordering part number.
4. BGA package marking omits leading S29 and packing type designator from ordering part number.
S29AL016J
Number
S29AL016J
D a t a
Device
S h e e t
Option
Speed
55
70
70
Device Number/Description
S29AL016J
16 Megabit Flash Memory manufactured using 110 nm process technology
3.0 Volt-only Read, Program, and Erase
S29AL016J Valid Combinations
T
Temperature Range
( A d v a n c e
Package Type,
Material, and
TFI, TFN
BFI, BFN
FFI, FFN
FFI, FFN
F
BFN
TFN
TFI
BFI
I
S29AL016J
01
I n f o r m a t i o n )
Number
R1, R2
01, 02,
Model
03, 04
01, 02
0
Packing Type
0 = Tray
1 = Tube
2 = 7” Tape and Reel
3 = 13” Tape and Reel
Model Number
01 = V
02 = V
03 = V
04 = V
R1 = V
R2 = V
Temperature Range
I
NI = Extended (-40°C to +125°C)
Package Material Set
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
Speed Option
55 = 55 ns Access Speed
70 = 70 ns Access Speed
= Industrial (-40°C to +85°C)
0, 2, 3
0, 2, 3
0, 2, 3
CC
CC
CC
CC
CC
CC
0, 3
0, 3
0, 3
Packing
= 2.7 - 3.6V, top boot sector device (CFI Support)
= 2.7 - 3.6V, bottom boot sector device (CFI Support)
= 2.7 - 3.6V, top boot sector device (No CFI Support)
= 2.7 - 3.6V, bottom boot sector device (No CFI Support)
= 3.0 - 3.6V, top boot sector device (CFI Support)
= 3.0 - 3.6V, bottom boot sector device (CFI Support)
Type
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
VBK048
VBK048
VBK048
LAE064
LAE064
TS048
TS048
TS048
(Note 3)
(Note 3)
(Note 3)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
Description
Package
Fine-Pitch BGA
Fine-Pitch BGA
Fine-Pitch BGA
Fortified BGA
Fortified BGA
TSOP
TSOP
TSOP
13

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