upc1458 Renesas Electronics Corporation., upc1458 Datasheet - Page 8

• Manufacturer Part Number: upc1458
• Description: General Purpose Dual Operational Amplifier
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED SOLDERING CONDITIONS
representative.
TYPES OF SURFACE MOUNT DEVICE
µ
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
TYPES OF THROUGH HOLE DEVICE
µ
8
PC1458G2: 8-pin plastic SOP (5.72 mm (225))
Infrared Ray Reflow
Vapor Phase Soldering
Wave Soldering
Partial Heating Method
PC1458C: 8-pin plastic DIP (7.62 mm (300))
Wave soldering
Soldering method
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
µ
PC1458 should be soldered and mounted under the following recommended conditions.
Process
device will be damaged by heat stress.
Solder temperature: 260°C or below,
Flow time: 10 seconds or below
Peak temperature: 215°C or below (Package surface temperature),
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Pin temperature: 300°C or below,
Peak temperature: 230°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 1 time.
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Heat time: 3 seconds or less (Per each side of the device).
Data Sheet G12195EJ6V0DS
Soldering conditions
Conditions
Recommended condition
symbol
WS60-00-1
VP15-00-1
IR30-00-1
Symbol
–
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PC1458