upc177 Renesas Electronics Corporation., upc177 Datasheet - Page 9

• Manufacturer Part Number: upc177
• Description: Upc177 Datasheets Single Power Supply Quad Comparators
• Manufacturer: Renesas Electronics Corporation.

<R>
<R>
RECOMMENDED SOLDERING CONDITIONS
conditions.
representative.
Type of Surface Mount Device
μ
μ
Note Pb-free (This product does not contain Pb in external electrode and other parts.)
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
REFERENCE DOCUMENTS
Infrared ray reflow
Wave soldering
Partial heating method
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICE MOUNT MANUAL
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL
SYSTEM-STANDARD LINEAR IC
REVIEW OF QUALITY AND RELIABILITY HANDBOOK
NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL
SYSTEM
PC177GR-9LG-A
PC339GR-9LG-A
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
PC177GR-9LG,
device will be damaged by heat stress.
Process
Note
Note
,
,
μ
μ
μ
PC177GR(5)-9LG-A
PC339GR(5)-9LG-A
Document Name
Maximum number of reflow processes: 3 times.
Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum
number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Peak temperature: 260°C, Reflow time: 60 seconds or less (at 220°C or higher),
PC339GR-9LG should be soldered and mounted under the following recommended
Data Sheet G17933EJ3V0DS
Note
Note
,
: 14-pin plastic TSSOP (5.72 mm (225))
Conditions
μ
C11531E
http://www.necel.com/pkg/en/mount/index.html
IEI-1212
C12769E
C10983E
PC177GR-9LG,
Document No.
μ
PC339GR-9LG
WS60-00-1
IR60-00-3
Symbol
P350
9