upc8002 Renesas Electronics Corporation., upc8002 Datasheet - Page 30

• Manufacturer Part Number: upc8002
• Description: Second Mixer If Amplifier For Digital Cordless Telephones
• Manufacturer: Renesas Electronics Corporation.

11. RECOMMENDED SOLDERING CONDITIONS
30
Partial heating
method
Infrared Ray Reflow
VPS
Soldering process
MANUAL" (C10535E).
Note Exposure limit before soldering after dry-pack package is opened.
Caution Do not apply more than one soldering method at any one time, except for " Partial heating
PC8002GR
TYPE OF SURFACE MOUNT DEVICE
The following conditions ( see table below) must be met when soldering this product.
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
Please consult with our sales offices in case other soldering process or condition is used.
Storage conditions : 25 ˚C and relative humidity at 65 % or less.
method".
Peak package's surface temperature: 235 ˚C or below.
Reflow time : 30 seconds or below (210 ˚C or higher),
Number of reflow processes : MAX.2
Exposure limit
Peak package's temperature: 215 ˚C or below.
Reflow time : 40 seconds or below (200 ˚C or higher),
Number of reflow processes : MAX. 2
Exposure limit
Terminal temperature : 300 ˚C or below,
Time : 3 seconds or below (Per side of pin position)
Note
(10 hours pre-baking is required at 125 ˚C afterwards)
Note
(10 hours pre-baking is required at 125 ˚C afterwards)
: 7 days
: 7 days
Soldering conditions
IR35-107-2
VP15-107-2
Symbol
PC8002