upc4556 Renesas Electronics Corporation., upc4556 Datasheet - Page 9

• Manufacturer Part Number: upc4556
• Description: High Performance Dual Decompensated Operational Amplifier??
• Manufacturer: Renesas Electronics Corporation.

RECOMMENDED SOLDERING CONDITIONS
representative.
Type of Surface Mount Device
µ
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
Type of Through-hole Device
µ
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
PC4556G2: 8-pin plastic SOP (5.72 mm (225))
PC4556C: 8-pin plastic DIP (7.62 mm (300))
Infrared Ray Reflow
Vapor Phase Soldering
Wave Soldering
Partial Heating Method
Wave Soldering
(only to leads)
Partial Heating Method
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
µ
PC4556 should be soldered and mounted under the following recommended conditions.
Process
device will be damaged by heat stress.
the package body does not get jet soldered.
Process
Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 time.
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 time.
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Data Sheet G10240EJ7V0DS
Conditions
Conditions
µ
PC4556
WS60-00-1
VP15-00-3
IR35-00-3
Symbol
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