mt46h32m32lfjg-6it Micron Semiconductor Products, mt46h32m32lfjg-6it Datasheet - Page 10

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mt46h32m32lfjg-6it

Manufacturer Part Number
mt46h32m32lfjg-6it
Description
Nand Flash And Mobile Lpdram 168-ball Package-on-package Pop Mcp Combination Memory Ti Omap?
Manufacturer
Micron Semiconductor Products
Datasheet

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MT46H32M32LFJG-6IT
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Electrical Specifications
PDF: 09005aef83070ff3
168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09
Note:
Table 5: Absolute Maximum Ratings
Stresses greater than those listed under “Absolute Maximum Ratings” may cause perma-
nent damage to the device. This is a stress rating only, and functional operation of the
device at these or any other conditions above those indicated in the operational sec-
tions of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect reliability.
Table 6: Recommended Operating Conditions
Parameters/Conditions
Vcc, Vdd, Vddq supply voltage
relative to Vss
Voltage on any pin
relative to Vss
Storage temperature range
Parameters
Supply voltage
I/O supply voltage
Operating temperature range
1. Supply voltage references Vcc, Vdd, or Vddq.
168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP
10
Vcc, Vdd,
Symbol
Vddq
Vcc, Vdd
Symbol
Vin
Vddq
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Min
–1.0
–0.5
–55
Min
1.70
1.70
–40
2.4 or (supply voltage
Electrical Specifications
0.3V), whichever is less
1.80
1.80
Typ
©2007 Micron Technology, Inc. All rights reserved.
+150
Max
2.4
Max
1.95
1.95
+85
1
+
Unit
Unit
°C
°C
V
V
V
V

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