mt46h32m32lfjg-6it Micron Semiconductor Products, mt46h32m32lfjg-6it Datasheet - Page 13

• Manufacturer Part Number: mt46h32m32lfjg-6it
• Description: Nand Flash And Mobile Lpdram 168-ball Package-on-package Pop Mcp Combination Memory Ti Omap?
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 7: 168-Ball VFBGA (Package Code: JG)
PDF: 09005aef83070ff3
168ball_nand_lpdram_j4xx_omap.pdf - Rev. I 6/09
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.27 SMD
ball pads.
168X Ø0.33
Seating
11 CTR
plane
0.08 A
0.5 TYP
A
2322 212019
Note:
18
1. All dimensions are in millimeters.
171615
14
12 ±0.1
11 CTR
13
12
11
Ball A1 ID
10
168-Ball NAND Flash and LPDRAM PoP (TI OMAP) MCP
9
0.5 TYP
8 7 6 5 4 3 2 1
0.6 ±0.1
13
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
12 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
0.9 MAX
Ball A1 ID
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.