vsc8164 Vitesse Semiconductor Corp, vsc8164 Datasheet - Page 13

• Manufacturer Part Number: vsc8164
• Description: 2.488 Gbit/sec To 2.7gbit/sec 1 16 Sonet/sdh Demux Semiconductor Corporation
• Manufacturer: Vitesse Semiconductor Corp

2.488 Gbit/sec to 2.7Gbit/sec
1:16 SONET/SDH Demux
Page 13
Package Thermal Considerations
die to the exposed surface of the heat spreader. The thermal resistance is shown in the following table
Table 4: Thermal Resistance
Thermal Resistance with Airflow
thermal paths including through the leads in an environment where the leads are exposed. The temperature dif-
ference between the ambient airflow temperature and the case temperature should be the worst case power of
the device multiplied by the thermal resistance.
Table 5: Thermal Resistance with Airflow
Maximum Ambient Temperature without Heatsink
Shown in the table below is the thermal resistance with airflow. This thermal resistance value reflects all the
The worst case ambient temperature without use of a heatsink is given by the equation:
where:
P
This package has been enhanced with a copper heat slug to provide a low thermal resistance path from the
CA
A(MAX)
(MAX)
C(MAX
Symbol
100 lfpm
200 lfpm
400 lfpm
600 lfpm
Airflow
Theta case to ambient at appropriate airflow
ca
jc
Power (1.1 W for VSC8164)
)
Ambient Air temperature
Case temperature (85
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: [phone]
Thermal resistance from
junction to case.
Thermal resistance from case to
ambient with no airflow,
including conduction through
the leads.
Description
VITESSE
VITESSE SEMICONDUCTOR CORPORATION
SEMICONDUCTOR CORPORATION
T
o
ca
C for VSC8164)
A MAX
14.5
(
21
18
16
o
C/W
)
=
T
C MAX
1.34
25.0
C/W
–
P
MAX
CA
Preliminary Datasheet
VSC8164
G52239-0, Rev. 3.3
5/17/00