mc10xs3412 Freescale Semiconductor, Inc, mc10xs3412 Datasheet - Page 48
mc10xs3412
Manufacturer Part Number
mc10xs3412
Description
Quad High Side Switch Dual 10m, Dual 12m
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MC10XS3412.pdf
(51 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
mc10xs3412CH
Manufacturer:
FREESCALE
Quantity:
20 000
Device on Thermal Test Board
48
10XS3412
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Outline:
Area A:
Ambient Conditions:
Figure 20. Steady State Thermal Resistance in Dependance on Heat Streading Area;
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
76.2mm x 114.3mm board area,
including edge connector for thermal
testing, 74mm x 74mm buried layers
area
Cu heat-spreading areas on board
surface
Natural convection, still air
0
1s JEDEC Thermal Test Board with Spreading Areas
100
RJA11
Heat spreading area [sqmm]
200
RJA12=RJA21
Table 25. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
300
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θ
JA mn
θJA
is the thermal resistance between die junction and
400
Area A
(mm
150
300
450
600
0
2
RJA22
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip
m = 1,
46.42
41.60
40.02
38.86
38.04
500
n = 1
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
600
37.03
32.90
31.63
30.68
29.99
m = 2,
53.82
51.27
55.05
49.47
48.63
n = 2
(°C/W)