74hct3g04dp NXP Semiconductors, 74hct3g04dp Datasheet - Page 14

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74hct3g04dp

Manufacturer Part Number
74hct3g04dp
Description
Inverters Gates
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINES
2003 Oct 30
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
Inverter
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT505-2
max.
1.1
A
0.15
0.00
A 1
8
1
0.95
0.75
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.38
0.22
b p
b p
5
0
0.18
0.08
4
JEDEC
c
- - -
w
REFERENCES
D
3.1
2.9
M
(1)
E
3.1
2.9
(1)
c
JEITA
scale
0.65
14
2.5
e
A
H E
4.1
3.9
A 2
A 1
0.5
L
H E
E
5 mm
0.47
0.33
detail X
L p
74HC3G04; 74HCT3G04
0.2
v
L
L p
PROJECTION
EUROPEAN
0.13
w
A
(A 3 )
0.1
y
X
v
Product specification
M
0.70
0.35
Z
A
(1)
ISSUE DATE
02-01-16
8
0
SOT505-2

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