74lv04db NXP Semiconductors, 74lv04db Datasheet
74lv04db
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74lv04db Summary of contents
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... Specified from +85 C and from +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LV04N +125 C 74LV04D +125 C 74LV04DB +125 C 74LV04PW +125 C 74LV04BQ +125 Description DIP14 plastic dual in-line package; 14 leads (300 mil) SO14 plastic small outline package ...
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... NXP Semiconductors 4. Functional diagram mna342 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning GND 7 Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14 74LV04_3 Product data sheet ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin GND Functional description Table 3. Function table H = HIGH voltage level LOW voltage level. Input Limiting values Table 4. ...
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... NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter P total power dissipation tot DIP14 package SO14 package (T)SSOP14 package DHVQFN14 package [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I supply current CC I additional supply current ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions t propagation delay nA to nY; see power dissipation capacitance V = GND [1] All typical values are measured at T [2] ...
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... NXP Semiconductors Table 8. Measurement points Supply voltage V CC < 2 3.6 V 4.5 V Test data is given in Table 9. Definitions test circuit Termination resistance should be equal to output impedance Load resistance Load capacitance including jig and probe capacitance. L Fig 7. Load circuit for switching times Table 9 ...
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... NXP Semiconductors 12. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 10 ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74LV04_3 20071204 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Abbreviations ...