74lv02bq NXP Semiconductors, 74lv02bq Datasheet
74lv02bq
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74lv02bq Summary of contents
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... Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LV02D +125 C 74LV02PW +125 C 74LV02BQ +125 Description SO14 plastic small outline package; 14 leads; body width 3.9 mm TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad fl ...
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... NXP Semiconductors 4. Functional diagram mna216 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning GND 7 Fig 4. Pin configuration SO14 and TSSOP14 5.2 Pin description Table 2. Pin description ...
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... NXP Semiconductors Table 2. Pin description …continued Symbol Pin GND Functional description Table 3. Function table H = HIGH voltage level LOW voltage level don’t care Input Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134) ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate [1] The static characteristics are guaranteed from ...
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... NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I supply current CC I additional supply current CC C input capacitance I [1] Typical values are measured at T 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 6. The input (nA, nB) to output (nY) propagation delays Table 8. Measurement points Supply voltage V CC < 2 3.6 V 4.5 V Test data is given in Table 9. Defi ...
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... NXP Semiconductors 12. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.01 0.069 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74LV02_4 20071220 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Abbreviations ...