pcf2120 NXP Semiconductors, pcf2120 Datasheet - Page 9

• Manufacturer Part Number: pcf2120
• Description: Quartz Oscillator
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Bare die outline
Fig 10. Bare die outline PCF2120U
16. Soldering of SMD packages
PCF2120_1
Product data sheet
Wire bond die; 7 bonding pads; 0.57 x 1.1 x 0.2 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
PCF2120U
VERSION
OUTLINE
0.212
0.188
A
1.1
D
4
0.57
3
E
Table 7.
Values x and y in m.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Pad
1
2
3
4
5
6
7
x
5
IEC
0
0
0.07
P
D
y
1
2
6
0.06
P
2
Bonding pad coordinates
1
JEDEC
7
0.07
P
3
X
x
+313
+93
+127
+380
REFERENCES
236
259
137
0.06
P
4
Rev. 01 — 5 February 2008
E
bonding pad 1
corner
P
P
1
2
and P
and P
JEITA
3
4
: pad size
: passivation opening
y
+187
+187
+187
172
172
172
172
A
0
PROJECTION
EUROPEAN
P
P
2
1
detail X
scale
0.5
P
4
PCF2120
P
© NXP B.V. 2008. All rights reserved.
Quartz oscillator
3
ISSUE DATE
07-12-07
08-02-01
1 mm
PCF2120U
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