pcf26100 NXP Semiconductors, pcf26100 Datasheet

no-image

pcf26100

Manufacturer Part Number
pcf26100
Description
Bluetooth Adapter Ic
Manufacturer
NXP Semiconductors
Datasheet
Preliminary specification
File under Integrated Circuits, IC17
DATA SHEET
PCF26100
Bluetooth Adapter IC
INTEGRATED CIRCUITS
2001 Jun 19

Related parts for pcf26100

pcf26100 Summary of contents

Page 1

... DATA SHEET PCF26100 Bluetooth Adapter IC Preliminary specification File under Integrated Circuits, IC17 INTEGRATED CIRCUITS 2001 Jun 19 ...

Page 2

... Philips Semiconductors Bluetooth Adapter IC CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING INFORMATION 5.1 Pinning 5.2 Pin description 6 FUNCTIONAL DESCRIPTION 6.1 PCF26100 overview 6.2 BlueRF pin mapping 6.3 Timing 6.4 Serial interface 6.5 Registers 7 REFERENCE DOCUMENTS 8 LIMITING VALUES 9 DC CHARACTERISTICS 10 AC CHARACTERISTICS 11 APPLICATIONS 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction to soldering surface mount packages 13 ...

Page 3

... Bluetooth system based on existing components. The adapter ASIC implementation incorporates, as much as possible, features to come to a complete Bluetooth system, meeting the Bluetooth RF requirements. From the Bluetooth system point of view the PCF26100 is a transparent adaptation device between the baseband controller and the UAA3558 radio. PACKAGE DESCRIPTION plastic thin fi ...

Page 4

... CHANNEL CHANNEL CHANNEL CONVERSION SCANTEST Fig.1 Block diagram. 4 Preliminary specification PCF26100 UBMODE REFERENCE CLOCK 2.048 MHz T_SW DIVIDER MUX DAC RX SAMPLE PCF26100 ADC DAC PACNTL 3-WIRE INTERFACE STATIC TEST TEST_EN ANATEST SHIFTCTRL REF_CLK T_SW T_GFSK R_DATA SLCCTR RSSI PACNTL S_EN ...

Page 5

... Philips Semiconductors Bluetooth Adapter IC 5 PINNING INFORMATION 5.1 Pinning 2001 Jun 19 MBL245 PCF26100ET Fig.2 Pin configuration. 5 Preliminary specification PCF26100 ...

Page 6

Acrobat reader. white to force landscape pages to be ... 5.2 Pin description Table 1 Pin description for the TFABGA48 package SYMBOL BALL POR ...

Page 7

Acrobat reader. white to force landscape pages to be ... SYMBOL BALL PACNTL B8 analog PA control output to external analog ...

Page 8

... SYS_CLK and REF_CLK clocks are controlled within the PCF26100. From the system clock a low-power 3.2 kHz clock LPO_CLK is generated. From the PCF26100 a 1 MHz TX_CLK is generated to be used in the baseband controller to clock out the transmit data on TX_DATA. The serial interface to the baseband controller is a JTAG interface ...

Page 9

... Timing The timing for the radio is generated in the PCF26100 using a minimal number of baseband signals. The channel programming is received from the JTAG serial interface. The SYNTH_ON signal is used to determine the start and end of the packet. The radio SLCCTR signals is also controlled with PX_ON. ...

Page 10

... Any variation on V DDA relation to a variation in the T_GFSK levels. The V power supply should be provided from a voltage reference. The TX_CLK output is activated during the DC_BIAS phase and the Txdata phase. 10 Preliminary specification PCF26100 VALUE UNIT 0.35 s S_EN start ...

Page 11

... Bluetooth Adapter IC 6.3.2 R ESET The PCF26100 is reset with a Power-on reset using the VIO_POWER signal. This will reset all registers and put the device into a known state. The POR_EXT reset signal will also reset the device and put it in the same state as the Power-on reset ...

Page 12

... JTAG The JTAG serial interface is used to control the PCF26100 and subsequently the radio. The PCF26100 must be the only slave on the JTAG bus as the PCF26100 does not allow for multi-slave operation. The JTAG interface protocol used is fully compliant with the standard set out in “IEEE Std 1149.1-1990” . The following features are supported: ...

Page 13

... PA power control 25 00 adapter control 26 64 GFSK DC bias start delay 28 00 GFSK look-up table values channel conversion number channel conversion number trx 13 Preliminary specification DESCRIPTION channel number (m) DESCRIPTION PCF26100 1 0 ...

Page 14

... Jun static value bits static value bits static value bits Preliminary specification RXFREQ TXFREQ PCF26100 not used ...

Page 15

... Preliminary specification PCF26100 ...

Page 16

... S_EN_PULSE_DEL + ( RSSI_START 4 t GFSK_DC_BIAS + ( power control GFSK table value 16 Preliminary specification ACTUAL VALUE RSSI The T_GFSK signal should have a DC_Bias DDA PCF26100 UNIT ...

Page 17

... 255 ------------- - V DDA 17 Preliminary specification RESET VALUE (HEX (1) DECIMAL PCF26100 VALUE HEX 102 66 117 75 130 82 138 8A 142 8E 144 90 145 91 ...

Page 18

... T_SW = 2.048 MHz. 3 test.2 These 3 bits are used for test purposes. 2 test.1 1 test.0 0 This bit is reserved and should not be used. 2001 Jun grst pa float clk en 18 Preliminary specification rdy DESCRIPTION test.2 test.1 DESCRIPTION PCF26100 test.0 ...

Page 19

... UAA3558 Bluetooth RF Transceiver (Philips data sheet). 2. PCF26002 Bluetooth baseband controller (Philips data sheet). 3. BlueRF specification (ARM Ltd). 2001 Jun 19 (XO_ ) TRIM XO_trim. XO_trim. XO_trim (ID ID.6 ID.5 19 Preliminary specification XO_trim. XO_trim. XO_trim DESCRIPTION ID.4 ID.3 ID.2 DESCRIPTION PCF26100 1 0 XO_trim ID.1 ID.0 ...

Page 20

... OL V HIGH-level output voltage OH I input leakage current LI Notes 1. V should be supplied from a stable source. DDA 2. Standby power consumption is measured when SYS_CLK_REQ = 0. 2001 Jun 19 DESCRIPTION MIN. 2.7 2.7 2.7 0.5 0.7V DD(I/O) 2 Preliminary specification PCF26100 MIN. MAX. UNIT 3.6 ...

Page 21

... DAC load resistance L(DAC) C DAC load capacitance L(DAC) 2001 Jun 19 MIN. TYP. 13 3.2 6.5 1 2.048 40/ 1.0 0 600 21 Preliminary specification PCF26100 MAX. UNIT MHz MHz MHz 5 MHz MHz % bit +0.5 LSB + DDA M bit +1.0 LSB +0.5 LSB + ...

Page 22

... XOUT V DDA 13 MHz V DD(I/O) XIN V DD LPO_CLK V SS(osc) SYS_CLK V SSA BXTLEN SYS_CLK_REQ V SS(I/ BRCLK TX_CLK BTXD TX_DATA BRXD RX_DATA T_SW PCF26100 T_GFSK BPKTCTL PX_ON BSEN SYNTH_ON R_DATA SLCCTR BnDEN SI_CMS RSSI BDCLK SI_CLK BMISO SI_CDO REF_CLK BMOSI SI_CDI S_EN POR S_DATA S_CLK ...

Page 23

... Acrobat reader. white to force landscape pages to be ... V DD(osc) XOUT 13 MHz XIN LPO_CLK LPO_CLK SYS_CLK SYS_CLK SYS_CLK_REQ SYS_CLK_REQ TX_CLK TX_CLK TX_DATA TX_DATA RX_DATA RX_DATA PCF26100 VWS2600x PX_ON PX_ON SYNTH_ON SYNTH_ON CMS SI_CMS CLK SI_CLK CDI SI_CDO REF_CLK CDO SI_CDI POR POR ...

Page 24

... SOT641-1 2001 Jun 2.5 scale 5.1 5.1 0.5 3.5 0.15 0.1 4.9 4.9 REFERENCES JEDEC EIAJ MO-211 24 Preliminary specification detail 0.12 0.1 EUROPEAN PROJECTION PCF26100 SOT641 ISSUE DATE 00-10-10 ...

Page 25

... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 25 Preliminary specification PCF26100 ...

Page 26

... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Jun 19 SOLDERING METHOD WAVE not suitable (2) not suitable suitable (3)(4) not recommended (5) not recommended 26 Preliminary specification PCF26100 (1) REFLOW suitable suitable suitable suitable suitable ...

Page 27

... Preliminary specification PCF26100 DEFINITIONS These products are not Philips Semiconductors ...

Page 28

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...

Related keywords