tda8034at NXP Semiconductors, tda8034at Datasheet - Page 23
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tda8034at
Manufacturer Part Number
tda8034at
Description
Smart Card Interface
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8034AT.pdf
(29 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
tda8034at/C1
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
15. Abbreviations
TDA8034T_TDA8034AT_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 12.
Acronym
EMV
ESD
ESR
FCDM
HBM
LDO
MM
NMOS
POR
Fig 16. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Europay MasterCard VISA
ElectroStatic Discharge
Equivalent Series Resistor
Field Charged Device Model
Human Body Model
Low Drop-Out
Machine Model
Negative-channel Metal-Oxide Semiconductor
Power-On Reset
Rev. 01 — 5 February 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
TDA8034T; TDA8034AT
temperature
peak
Smart card interface
© NXP B.V. 2010. All rights reserved.
001aac844
time
23 of 29