pca9506 NXP Semiconductors, pca9506 Datasheet - Page 26

• Manufacturer Part Number: pca9506
• Description: 40-bit I2c-bus I/o Port With Reset, Oe, And Int
• Manufacturer: NXP Semiconductors

Philips Semiconductors
15. Handling information
16. Soldering
9397 750 14939
Product data sheet
16.1 Introduction to soldering surface mount packages
16.2 Reflow soldering
16.3 Wave soldering
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be totally safe, it is desirable to take precautions appropriate to handling MOS
devices. Advice can be found in Data Handbook IC24 under “Handling MOS devices” .
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
•
•
below 225 C (SnPb process) or below 245 C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
– for packages with a thickness < 2.5 mm and a volume
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
thick/large packages.
Rev. 01 — 14 February 2006
40-bit I
2.5 mm
2
C-bus I/O port with RESET, OE, and INT
3
so called small/thin packages.
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
350 mm
PCA9506
3
so called
26 of 30