pca9703 NXP Semiconductors, pca9703 Datasheet - Page 4

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pca9703

Manufacturer Part Number
pca9703
Description
18 V Tolerant Spi 16-bit Gpi With Maskable Int
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
PCA9703_1
Product data sheet
6.2 Pin description
Table 2.
[1]
Symbol
SDOUT
INT
INT_EN
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
V
IN8
IN9
IN10
IN11
IN12
IN13
IN14
IN15
CS
SCLK
SDIN
V
SS
DD
HWQFN24 package die supply ground is connected to both V
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
Pin
TSSOP24 HWQFN24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Pin description
Rev. 01 — 23 February 2010
22
23
24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
[1]
Type
output
output
input
input
input
input
input
input
input
input
input
ground
input
input
input
input
input
input
input
input
input
input
input
supply
18 V tolerant SPI 16-bit GPI with maskable INT
Description
3-state serial data output; normally
high-impedance
open-drain interrupt output (active LOW)
GPI pin enable and interrupt output enable
input port 0
input port 1
input port 2
input port 3
input port 4
input port 5
input port 6
input port 7
ground supply
input port 8
input port 9
input port 10
input port 11
input port 12
input port 13
input port 14
input port 15
chip select (active LOW)
serial input clock
serial data input (20 μA pull-down)
supply voltage
1 = GPI pin and interrupt output are enabled
0 = GPI pin and interrupt output are disabled and
interrupt output is high-impedance
SS
pin and exposed center pad. V
PCA9703
© NXP B.V. 2010. All rights reserved.
SS
pin must
4 of 27

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