sta264 STMicroelectronics, sta264 Datasheet - Page 4

• Manufacturer Part Number: sta264
• Description: Sirius Overlay Decoder
• Manufacturer: STMicroelectronics

Package information
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2.
DIM.
ddd
eee
A1
A2
A3
A4
D1
E1
fff
A
D
E
b
e
F
TFBGA 249 mechanical data and package dimensions
14.850 15.000 15.150 0.5846 0.5906 0.5965
14.850 15.000 15.150 0.5846 0.5906 0.5965
0.210
0.350
MIN.
12.800
12.800
0.790
0.200
0.400
0.800
1.100
TYP.
mm
MAX.
1.200
0.600
0.450 0.0138 0.0157 0.0177
0.100
0.150
0.080
0.0083
MIN.
0.0311
0.0079
0.5039
0.5039
0.0315
0.0433
inch
TYP.
0.0472
0.0236
0.0039
0.0059
0.0031
MAX.
Thin Profile Pitch Ball Grid Array
TFBGA 240+9 (15x15x1.2mm)
MECHANICAL DATA
OUTLINE AND
7272773 C
STA264