mpc8544e Freescale Semiconductor, Inc, mpc8544e Datasheet - Page 81

• Manufacturer Part Number: mpc8544e
• Description: Mpc8544e Powerquicc Iii Integrated Processor
• Manufacturer: Freescale Semiconductor, Inc

18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
Freescale Semiconductor
Package Parameters for the MPC8544E FC-PBGA
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Preliminary—Subject to Change Without Notice
Table 61. Package Parameters
Parameter
Freescale Confidential Proprietary
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Table
Package Description
61.
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