mpc8241tzq266c Freescale Semiconductor, Inc, mpc8241tzq266c Datasheet - Page 50

• Manufacturer Part Number: mpc8241tzq266c
• Description: Mpc8241 Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

System Design Information
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
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The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
1.5
0.5
2
1
0
Figure 31. Thermal Performance of Select Thermal Interface Material
0
th
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
St.
10
20
Contact Pressure (psi)
30
40
50
800-347-4572
781-935-4850
800-248-2481
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
Freescale Semiconductor
80