mpc8272ec Freescale Semiconductor, Inc, mpc8272ec Datasheet - Page 51

• Manufacturer Part Number: mpc8272ec
• Description: Powerquicc Ii
• Manufacturer: Freescale Semiconductor, Inc

Package
Package
9
Figure 13 shows the side profile of the PBGA package.
Table 20 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface
nomenclature of the 516 PBGA package.
51
Plated substrate via
1 mm pitch
Package
VR, ZQ
Code
In the VR package, sphere composition is lead-free (refer to Table 2). This
requires higher temperature reflow than what is required for other
PowerQUICC II packages. Users should consult “Motorola PowerQUICC II™
Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at
www.motorola.com/semiconductors.
Transfer molding compound
MPC8272 PowerQUICC II™ Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
NOTE: Temperature Reflow for the VR Package
Figure 13. Side View of the PBGA Package Remove
PBGA
Type
Freescale Semiconductor, Inc.
For More Information On This Product,
Table 20. Package Parameters
Go to: www.freescale.com
Outline
27 x 27
(mm)
attach
Die
DIE
Interconnects
Ball bond
Wire bonds
516
Pitch
(mm)
1
Nominal Unmounted
Height (mm)
Screen-printed
solder mask
Cu substrate traces
Resin glass epoxy
2.25
MOTOROLA