mpc8640 Freescale Semiconductor, Inc, mpc8640 Datasheet - Page 114

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mpc8640

Manufacturer Part Number
mpc8640
Description
Integrated Host Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Thermal
The thermal model uses approximate dimensions to reduce grid. Please refer to the case outline for actual
dimensions.
19.2.4
The MPC8640 has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. For proper operation, the monitoring device used should
auto-calibrate the device by canceling out the V
The following are the specifications of the MPC8640 on-board temperature diode:
114
V
V
Operating range 2–300 μA
Diode leakage < 10 nA at 125 °C
Ideality factor over 5–150 μA at 60 °C: n = 1.0275
f
f
> 0.40 V
< 0.90 V
Temperature Diode
Conductivity
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Bump and Underfill (12.4 × 15.3 × 0.07 mm)
Silicon
k
k
k
k
k
k
k
z
x
y
z
x
y
z
C5 Solder layer (33 × 33 × 0.4 mm)
Substrate (33 × 33 × 1.2 mm)
Die (12.4 × 15.3 × 0.86 mm)
Collapsed Resistance
Figure 62. Recommended Thermal Model of MPC8640
Temperature
dependent
Value
0.034
0.034
13.5
13.5
5.3
5.3
9.6
BE
W/(m • K)
W/(m • K)
W/(m • K)
variation of each MPC8640’s internal diode.
Unit
±
0.9%
y
z
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
Bump and Underfill
C5 solder layer
Substrate
Substrate
Die
Die
Freescale Semiconductor

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