isp1302 NXP Semiconductors, isp1302 Datasheet - Page 56

• Manufacturer Part Number: isp1302
• Description: Isp1302 Universal Serial Bus On-the-go Transceiver With Carkit Support
• Manufacturer: NXP Semiconductors

NXP Semiconductors
18. Additional soldering information
19. Abbreviations
ISP1302_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
A more in-depth account of soldering WLCSP (Wafer-Level Chip-Size Package) can be
found in Application Note AN10439 “Wafer Level Chip Scale Package” .
Table 72.
Acronym
ATX
FFT
HNP
I
LSB
MIC
NRZ
OTG
POR
PORP
RxD
SE0
SIE
SoC
SOF
2
Fig 27. Temperature profiles for large and small components
C-bus
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Rev. 01 — 24 May 2007
= minimum soldering temperature
Description
Analog USB Transceiver
Fast Fourier Transform
Host Negotiation Protocol
Inter IC-bus
Least Significant Bit
Microphone
Non-Return-to-Zero
On-The-Go
Power-On Reset
Power-On Reset Pulse
Receive Data
Single-Ended Zero
Serial Interface Engine
System-on-a-Chip
Start-Of-Frame
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
USB OTG transceiver with carkit support
temperature
peak
© NXP B.V. 2007. All rights reserved.
ISP1302
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