mc33794 Freescale Semiconductor, Inc, mc33794 Datasheet - Page 6

• Manufacturer Part Number: mc33794
• Description: Electric Field Imaging Device
• Manufacturer: Freescale Semiconductor, Inc

6
MC33794
Table 2. Maximum Ratings
permanent damage to the device.
Notes
Peak VPWR Voltage
Double Battery
ESD Voltage
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Lead Soldering Temperature (for 10 Seconds)
1.
2.
3.
4.
5.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1 Minute Maximum T
Human Body Model
Machine Model
Junction-to-Ambient
Junction-to-Case
Junction-to-Board
ESD1 performed in accordance with the Human Body Model (C
ESD2 performed in accordance with the Machine Model (C
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
(2)
(4)
(5)
(1)
(3)
A
= 30°C
Rating
MAXIMUM RATINGS
ZAP
= 200 pF, R
ZAP
= 100 pF, R
ZAP
= 0 Ω).
ZAP
V
T
Symbol
V
V
V
SOLDER
DBLBAT
T
PWRPK
R
R
R
= 1500 Ω).
ESD1
ESD2
STG
T
T
θ
θ
θ
A
J
JA
JC
JB
-55 to 150
-40 to 150
-40 to 85
±2000
Value
±200
26.5
260
0.2
3.0
40
41
Freescale Semiconductor
°C/W
Unit
°C
°C
°C
°C
V
V
V
Sensors