uja1023 NXP Semiconductors, uja1023 Datasheet - Page 46

• Manufacturer Part Number: uja1023
• Description: Uja1023 Lin-i/o Slave
• Manufacturer: NXP Semiconductors

Philips Semiconductors
16. Revision history
Table 37.
UJA1023_4
Product data sheet
Document ID
UJA1023_4
Modifications:
UJA1023_3
UJA1023_2
(9397 750 12022)
Revision history
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Release date
20060705
20060209
20050203
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
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Section 7.2.3.4 “Cyclic sense
Table 25 “PxReq frame bit
Table 26 “PxReq frame bit
Table 32 “Static
Table 33 “Dynamic
Previous Fig 16 “Test circuit for automotive transients” is replaced by text
Data sheet status
Product data sheet
Preliminary data sheet
Objective specification
characteristics”: updated
Rev. 04 — 5 July 2006
characteristics”: updated
allocation”: updated
description”: updated
mode”: updated
10 C measured in the atmosphere of the reflow oven. The package
Change notice
-
-
-
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Supersedes
UJA1023_3
UJA1023_2
-
UJA1023
LIN-I/O slave
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