saf-xc878m-16ffi5v Infineon Technologies Corporation, saf-xc878m-16ffi5v Datasheet - Page 141
saf-xc878m-16ffi5v
Manufacturer Part Number
saf-xc878m-16ffi5v
Description
8-bit Single-chip Microcontroller
Manufacturer
Infineon Technologies Corporation
Datasheet
1.SAF-XC878M-16FFI5V.pdf
(145 pages)
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Price
Part Number:
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Manufacturer:
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5
Chapter 5
5.1
Table 56
Table 56
Parameter
PG-LQFP-64-4 (XC878)
Thermal resistance junction
case
Thermal resistance junction
lead
PG-VQFN-48-22 (XC874)
Thermal resistance junction
case
Thermal resistance junction
lead
1) The thermal resistances between the case and the ambient (
Data Sheet
combined with the thermal resistances between the junction and the case (
(
(
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
R
1)
1)
TJL
TJA
1)
1)
) given above, in order to calculate the total thermal resistance between the junction and the ambient
). The thermal resistances between the case and the ambient (
provides the thermal characteristics of the package used in XC878 and XC874.
provides the information of the XC87x package and reliability section.
Package and Quality Declaration
Package Parameters
Thermal Characteristics of the Packages
Symbol
R
R
R
R
TJC
TJL
TJC
TJL
CC -
CC -
CC -
CC -
Min.
133
Limit Values
R
TCA
Package and Quality Declaration
) , the lead and the ambient (
13.8
34.6
16.6
30.7
Max.
R
TCA
T
), the lead and the ambient (
J
=
R
T
TJC
A
+
R
Unit
K/W
K/W
K/W
K/W
), the junction and the lead
TJA
×
P
D
, where the
XC87xCLM
Notes
-
-
-
-
V1.5, 2011-03
R
TLA
) are to be
R
R
TJA
R
TLA
TJA
is
)
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