tja1027 NXP Semiconductors, tja1027 Datasheet - Page 4

• Manufacturer Part Number: tja1027
• Description: Lin 2.2/sae J2602 Transceiver
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Pinning information
TJA1027
Product data sheet
6.1 Pinning
6.2 Pin description
Table 3.
[1]
Symbol
RXD
SLP_N
n.c.
TXD
GND
LIN
V
n.c.
Fig 2.
BAT
HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is
recommended that the exposed center pad also be soldered to board ground.
a. TJA1027T/20: SO8 package
SLP_N
Pin configuration diagrams
RXD
TXD
n.c.
Pin description
1
2
3
4
All information provided in this document is subject to legal disclaimers.
Pin
1
2
3
4
5
6
7
8
[1]
TJA1027T
Rev. 1 — 20 October 2011
015aaa213
Description
receive data output (open-drain); active LOW after a wake-up
event
sleep control input (active LOW); resets wake-up request on RXD
not connected
transmit data input
ground
LIN bus line input/output
battery supply
not connected
8
7
6
5
n.c.
V
LIN
GND
BAT
index area
terminal 1
b. TJA1027TK/20: HVSON8 package
SLP_N
RXD
TXD
n.c.
LIN 2.2/SAE J2602 transceiver
1
2
3
4
Transparent top view
TJA1027TK
TJA1027
© NXP B.V. 2011. All rights reserved.
015aaa214
8
7
6
5
n.c.
V
LIN
GND
BAT
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